Our Products - Semiconductor
Characteristics:
- Provide uniform vacuum suckion force for Lamination
- Apply Vacuum force before heat up with special carrying mechanism
Application:
- Improve the lamination performance to achieve better adhesion between two bonding surfaces
- Solve the lamination difficulties in existance of Gap Cavity
- Improve the protection of the workpiece surface
Proposed Model:
- CV 300 - 1 stage
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