Our Products - Rigid PCB
Characteristics:
- Provide uniform vacuum suckion force for Lamination
- Apply Vacuum force before heat up with special carrying mechanism
- Can Accommodate over 100 um Gap Difference
Application:
- Improve the lamination performance to achieve better adhesion on DFR & functional film
- Solve the lamination difficulties in existance of Gap Cavity
- Improve the flatness of solder resist
Proposed Model:
- NT300+ CVP 600 - 2 stage
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