Our Products - Rigid PCB

Cedatec Inductive Bonding Lay Up System

Model : 168
Model : 258

Characteristics:

  • Pinless Lay Up without Hole Punching Process
  • Achieve Better Flatness in Pressing
  • Robust Inductive Heat Bonding Head design
  • Easy Operation

Application:

  • Higher Layer Count PCB Fabrication
  • Provide better & easy handling throughout whole pressing process


Proposed Model:

  • Pinless 258 
  • Bonding 168 ( with Pin )  

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