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Laser Drill Hole Protective Film for Metal Filling Process

Characteristics:

  • Heat Conductive Adhesive layer to lower localized temperature
  • No Residue remain after remove

Application:

  • High Quality Hole Achievement for Laser Drilling Process, especially down to 0.05 mm hole
  • Metal Hole Filling Preperg or Print Circuit Board

Proposed Model:

  • CB FS2

 

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