Japan Nikko Material Vacuum Laminator


  • Provide uniform vacuum suckion force for Lamination
  • Apply Vacuum force before heat up with special carrying mechanism
  • Can Accommodate over 100 um Gap Difference


  • Improve the lamination performance to achieve better adhesion on DFR & functional film
  • Solve the lamination difficulties in existance of Gap Cavity
  • Improve the flatness of liquid solder resist
  • Suitable to laminate ABF sheet or other dielectric sheet for CSP, PBGA and rigid flex PCB 

Proposed Model:

  • CV 300 - 1 stage 
  • CV 600 - 2 stage