Our Products - Flexible PCB

Characteristics:

• Provide uniform vacuum suckion force for Lamination
• Apply Vacuum force before heat up with special carrying mechanism
• Can Accommodate over 100 um Gap Difference

Application:

• Improve the lamination performance to achieve better adhesion on DFR & functional film
• Solve the lamination difficulties in existance of Gap Cavity
• Improve the flatness of liquid solder resist
• Suitable to laminate ABF sheet or other dielectric sheet for CSP, PBGA and rigid flex PCB 

Proposed Model:

• CV 300 - 1 stage 
• CV 600 - 2 stage